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  1. Hello! In the sake of simulation accuracy, we want to consider effects for lamination materials originating from punching edges and stacking / packaging / bundling within our simulation models. As Veigel has shown in https://publikationen.bibliothek.kit.edu/1000084543/15671960, packaging has significant influences on iron losses (up to 60 % more losses from packaging and punching edges than reference values from manufacturers). Bauer mentioned in https://www.springer.com/de/book/9783658242718, that one way to consider influences from punching edges is to use parameters for impacted regions from lamination materials, that were not finally heat treated and annealed, respectively, resulting in higher losses and differing magnetization behavior. One question, that still remains, is, how to model influences from packaging in FLUX? However, I wanted to ask, if there are any lamination materials within the FLUX material explorer, which may behave like non-finally annealed laminations regarding losses and magnetization curves? Thanks in advance for any response! Best regards, Michael
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