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Found 2 results

  1. I have to model heat conduction and dissipation from a electronic component through a think layer of copper present over a PCB i.e. there is an electronic component fixed to a PCB. Between the electronic component and the PCB there is a thin layer of copper. The copper layer extends beyond the electronic component and can conduct heat form the electronic component and can dissipate it to air. Can I use thermal shells to model the copper layer. If I can then how do I use it? Should I create a separate surface (with out any parent volumes) between the boundary surfaces of PCB and boundary surfaces of the electronic component?
  2. Hello all, in the analysis of cold plate . I have fins inside the fluid domain and outside the cold plate. If inside and outside fins are treated as thermal shells in acusolve then in hypermesh the elements of fins will be in which collector: fluid collector or coldplate solid collector? As in pic you can see the placement of inside fins and outside fins. Please help.
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