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We, students of MNIT Jaipur are doing a project related to Thermal
Stress in a plate enclosed with a mold of another material.
We are using HypperMesh as a tool for analysis of the problem. We have
gone through the tutorial "RD-1010: Thermal Stress Analysis of a
Coffee Pot Lid" but it doesn't include thermal loading (How to apply
temperature loading etc.). Can you please guide us for the same.

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Hi,


 


Please refer to OS-1100: Thermal Stress Analysis of a Printed Circuit Board with Anisotropic Material Properties


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